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![最終清洗機(jī)-華林科納CSE]( "最終清洗機(jī)-華林科納CSE")
最終清洗機(jī)-華林科納CSE華林科納CSE濕法處理設(shè)備是國(guó)內(nèi)最早致力于集成電路濕法設(shè)備的研制單位，多年來與眾多的集成電路生產(chǎn)企業(yè)密切合作，研制開發(fā)出適合于4吋-8吋的全自動(dòng)系列濕法處理設(shè)備設(shè)備用途: 清洗槽用于6/8吋兼容，集成電路制造工藝的最終清洗。配合LOAD and UNLOAD的上下料，實(shí)現(xiàn)干進(jìn)干出，每批次50枚Cassette Type的高效清洗。共有三種工藝槽，三水槽+一個(gè)干燥單元：1個(gè)DHF清洗槽、1個(gè)OF槽、1個(gè)SC-1槽、1個(gè)QDR槽、1個(gè)SC-2槽、1個(gè)QDR槽、1個(gè)干燥槽。設(shè)備功能:●Chemical BATH: 自動(dòng)換酸，自動(dòng)洗槽，自動(dòng)槽內(nèi)配比?！馜IW BATH : Pre Flow and After Change Function?！馭/D : 6/8 Inch 自動(dòng)換位，旋干?！駲C(jī)械手臂:Chuck Open/Close Type，Speed 為可控變動(dòng)；●Scheduler: 排程計(jì)算，實(shí)現(xiàn)多批次同時(shí)清洗，不發(fā)生Process Over Time?！馭afety: Door，TEMP，LEVEL，Exhaust…等等INTERLOCK Safety。設(shè)備工藝流程:●進(jìn)貨區(qū)(LOAD)→DHF(100:1)→OF 槽→SC-1 槽→QDR 槽→SC-2 槽→QDR 槽→S/D 槽→→出貨區(qū)(UNLOAD)●High WPH Type: AWB200-T。雙Cassette 50 枚/槽。●6/8 inch 兼容Cassette Type。●前面式機(jī)械手臂: ARM-1、ARM-2、ARM-3 共三套。●機(jī)臺(tái)上部設(shè)有高效過濾器（FFU)。 工藝技術(shù)指標(biāo):1. 該設(shè)備應(yīng)實(shí)現(xiàn)全自動(dòng)作業(yè)，可自動(dòng)過程控制工藝、沖水及干燥全套作業(yè)，并具備自動(dòng)供液、自動(dòng)洗槽、SC1-1槽帶有兆聲；可編程選擇工藝槽及工藝時(shí)間進(jìn)行清洗。2. 通過DHF/SC...
管道清洗機(jī)設(shè)備—華林科納CSE半自動(dòng)石英管清洗設(shè)備適用于臥式或立式石英管清洗優(yōu)點(diǎn)石英管清洗：臥式—標(biāo)準(zhǔn)/立式—選項(xiàng) 先進(jìn)的圖形化界面 極高的生產(chǎn)效率 最佳的占地 結(jié)合最先進(jìn)工藝技術(shù) 優(yōu)越的可靠性 獨(dú)特的模塊化結(jié)構(gòu) 極其便于維修 應(yīng)用 清洗不同尺寸的石英管一般特征 可編程使得清洗管旋轉(zhuǎn)，清洗更干凈 PVDF工藝槽 裝有清洗溶劑的儲(chǔ)備槽（根據(jù)使用化學(xué)品的數(shù)量）放置在工藝槽的后下方 — 直接注入且內(nèi)部進(jìn)行不斷循環(huán) 特別的噴淋嘴更益于石英管清洗 集成水槍和N2搶 單獨(dú)排液系統(tǒng) 安全蓋子 易于操作和控制 節(jié)約用酸系統(tǒng) 全自動(dòng)的清洗工藝步驟 備件 經(jīng)濟(jì)實(shí)惠的PP外殼材料—標(biāo)準(zhǔn)更多的石英管道清洗機(jī)設(shè)備相關(guān)資訊可以關(guān)注華林科納CSE官網(wǎng)（126xa.cn），現(xiàn)在熱線咨詢400-8768-096可立即獲取免費(fèi)的半導(dǎo)體清洗解決方案。
![零部件清洗機(jī)CSE]( "零部件清洗機(jī)CSE")
零部件清洗機(jī)_華林科納CSECleanStep的零部件被設(shè)計(jì)用于PECVD刻蝕清洗設(shè)備，以及石墨舟、石英舟、碳化硅舟等擴(kuò)散舟的刻蝕和清洗設(shè)備。優(yōu)點(diǎn) 通過關(guān)閉的工藝腔室的安全操作，加載和僅一次工藝腔室沖洗之后卸載，完成整個(gè)工藝過程。 安全門自鎖裝置 工藝腔室保護(hù)防止水溢流 排風(fēng)監(jiān)控部件 用于門自鎖的電導(dǎo)傳感器（僅適用于石英舟清洗設(shè)備） 簡(jiǎn)便、安全操作的高品質(zhì)觸摸屏 很少的化學(xué)品消耗產(chǎn)生最小的生產(chǎn)費(fèi)用，與浸泡式工藝相比至少節(jié)約2-3倍 減少了操作次數(shù) 化學(xué)品的消耗，與浸泡式工藝相比要少于大約10倍 穩(wěn)定的清洗工藝，水的消耗，與浸泡式工藝相比少于2倍 設(shè)備高利用率和低維修率，得益于它獨(dú)特的模塊化設(shè)計(jì)和長(zhǎng)壽命零部件的應(yīng)用 最佳的占地應(yīng)用CleanStep的零部件被設(shè)計(jì)用于PECVD刻蝕清洗設(shè)備，以及石墨舟、石英舟、碳化硅舟等擴(kuò)散舟的刻蝕和清洗設(shè)備。標(biāo)準(zhǔn)化設(shè)計(jì)的設(shè)備是用于2個(gè)石墨舟或4個(gè)石英舟的清洗。同時(shí)也強(qiáng)有力的證明了用噴淋工藝代替浸泡工藝不僅節(jié)約了工藝時(shí)間，同時(shí)也節(jié)約了化學(xué)品的消耗量。選項(xiàng) 廢液槽起重裝置 系統(tǒng)外殼結(jié)構(gòu)[FM認(rèn)可材質(zhì)] HF有毒氣體檢測(cè)裝置 Centrotherm 一套石墨舟花籃可裝載19片到21片晶圓«可拆卸石墨舟« Centrotherm 一套石墨舟可裝載23片«可拆卸石墨舟« 石英部件清洗的石英舟夾具 漏液盤連接閥 電阻率監(jiān)測(cè)裝置 手動(dòng)加載花籃干燥的烘干箱 30升的HNO3 / HF/ DI-H2O的預(yù)備槽 獨(dú)立的設(shè)備化學(xué)品供應(yīng)用于回收用過的HF 氮氧化物有毒氣體檢測(cè)裝置 晶圓背面腐蝕的ACL片盒夾 N2 凈化更多的半導(dǎo)體零部件清洗機(jī)設(shè)備相關(guān)資訊可以關(guān)注華林科納CSE官網(wǎng)（126xa.cn），現(xiàn)在熱線咨詢400-8768-096可立即獲取免費(fèi)的半導(dǎo)體清洗解決方案。
![半自動(dòng)石英管清洗機(jī)]( "半自動(dòng)石英管清洗機(jī)")
1、設(shè)備概況：主要功能：本設(shè)備主要采用手動(dòng)搬運(yùn)方式，通過對(duì)擴(kuò)散、外延等設(shè)備的石英管、碳化硅管腐蝕、漂洗等方式進(jìn)行處理，從而達(dá)到一個(gè)用戶要求的清洗效果。主體采用德國(guó)勞士領(lǐng) 瓷白PP板，骨架采用不銹鋼 外包PP 防腐板；設(shè)備名稱：半自動(dòng)石英管清洗機(jī)設(shè)備型號(hào)：CSE-SC-N401整機(jī)尺寸(參考)：4500mm*1500mm*2100mm；被清洗爐管尺寸（Max）：也可清洗其它可放入清洗槽中的石英器皿等被清洗物設(shè)備形式:室內(nèi)放置型;節(jié)拍：約1--12小時(shí)（節(jié)拍可調(diào)根據(jù)實(shí)際工藝時(shí)間而定） 操作形式：半自動(dòng)2、設(shè)備描述：此裝置是一個(gè)半自動(dòng)的處理設(shè)備。PROFACE 8.0英寸大型觸摸屏顯示 / 檢測(cè) / 操作清洗工作過程由三菱 / 歐姆龍PLC控制。3、設(shè)備特點(diǎn)： 腐蝕漂洗能力強(qiáng),性能穩(wěn)定,安全可靠;設(shè)備成本合理,自動(dòng)化程度高,使用成本低;技術(shù)先進(jìn),結(jié)構(gòu)合理,適宜生產(chǎn)線上大批次操作;結(jié)合華林科納公司全體同仁之力,多年品質(zhì)保障,使其各部分遠(yuǎn)遠(yuǎn)領(lǐng)先同類產(chǎn)品;設(shè)備上層電器控制系統(tǒng)及抽風(fēng)系統(tǒng)，中層工作區(qū)，下層為管道安裝維修區(qū)，主體結(jié)構(gòu)由清洗機(jī)主體、酸洗槽、水清洗槽、防漏盤、抽風(fēng)系統(tǒng)、工件滾動(dòng)系統(tǒng)、氮?dú)夤呐菹到y(tǒng)、支撐及旋轉(zhuǎn)驅(qū)動(dòng)機(jī)構(gòu)、管路部分、電控部分。本設(shè)備裝有雙防漏盤結(jié)構(gòu)，并有防漏檢測(cè)報(bào)警系統(tǒng)，在整臺(tái)設(shè)備的底部裝有接液盤。設(shè)備配有在槽體下方配有傾斜式防漏層。4、工藝流程：檢查水、電、氣正常→啟動(dòng)電源→人工上料→注酸→槽體底部氮?dú)夤呐荨⒐苻D(zhuǎn)動(dòng)（7轉(zhuǎn)/min）→進(jìn)入酸泡程序→自動(dòng)排酸(到儲(chǔ)酸箱)→槽體底部自動(dòng)注水（同時(shí)氣動(dòng)碟閥關(guān)閉）→懸浮顆粒物經(jīng)過溢流壩流出→排水碟閥打開（重顆粒雜質(zhì)排出）→初級(jí)潔凈水經(jīng)過溢流壩溢出→清洗次數(shù)重復(fù)循環(huán)（人工控制）→下料。 酸洗和水洗在同一槽內(nèi)完成1#，2#可通過循環(huán)泵循環(huán)使用...
Drying system CSE AdvantageThe CSE drying system uses IPA and N2 atomization, as well as the shape of a wafer from water.The technique of surface tension dryingDrying technology suitable for maximum size 300mm wafer can be single device or integrated in wet equipment the best area of landMature processNo water traceNo fragments Features and advantages ApplicationPolished chips, integrated circuits, MEMES, LED, photovoltaic, glass substratesGeneral characteristics can dry 25 to 50 pieces of wafer with a maximum diameter of 300mm at the same time for standard high or low side flower basketsSpecificationsProcess time: generally Hydrophilic wafer: less than 10 increase @ 0.12 MHydrophobic wafer: less than 30 increase @ 0.12 MMetal content: any metal is less than or equal t...
Wet Equipment-CSE Wet equipment Nantong CSE Semiconductor Equipment Co. Ltd. is suitable for many applications, including cleaning, etching, stripping, developing etc. Advantages of CSE wet process equipment wet equipment is suitable for many applications, including cleaning, etching, degumming and developing covers an area of small area reliability is strong unique module structureEasy maintenance and maintenance, low cost maximum compatible applicationEach module's separate air exhausting device easy to install and update modules based on the manipulator system Characteristics and advantagesMany different cleaning processes, such as RCA, IMEC, Pre-Diffusion, Pre-Metal, and various etching processes, including oxidationCompounds, nitrides, polysilicon, metals, silicide...
CSE chemical management systemThe automatic chemical management system is designed for the semiconductor industry, the micromachinery industry, and the Guang FuyeThe management of various acids, solvents and corroding agents used in it CSE chemical management systemAdvantage high securityLow cost 99.9% normal running time upgrades system covers an area of small areaA cross connection sold on a common marketTouch screen control The family members of the CSE chemical management system include chemical mixing, distribution and waste liquid recovery systems. Full automatic specialIt makes the product meet the requirements of the Fab workshop. These systems have the highest security and provide the greatest possible protectionWet equipment. The product is specially designed to be appl...
KOH etching is a chemical process used for the fabrication of silicon nanostructures. This etching process has been studied extensively in both research and real-world applications.CSE provides individualized solutions for customers that want to use this process by using theKOH etching tank along with their existing wet bench equipment. All ofCSE’s KOH tanks are manufactured on site and built per your specifications. All PFA material is used for cleanliness and compatibility.Definition of KOH EtchingPotassium Hydroxide (KOH) etching is a wet chemical etching process used to create cavities in silicon. Highly corrosive alkaline chemical compound (pH 12) is used in conjunction with DI water and thermal regulation. The etch rate is limited; and the precision of Si etching...
Manual wet cleaning equipment CSE/Ventilator CSE's manual wet equipment is a low cost, and it hasHigh level technology and highly active equipment. Our aim is to have youLimited automation should not be prevented from being brought to the end of your high end software and process controlThe economic benefits, this is the classic MANUAL WETPROCESSOR or "A ventilator. AdvantageModularized designCustomizable, extensible, and adjustable modular design to meet customer's special needsModular design, easy to insert and install module the best area of land the equipment shell itself can also be used as a ventilator the operation of a clever inverter or a passive device equipment shell can be made by customers to make use of different materials applicationThe wet proces...
WET PROCESSING-MANUAL WET BENCHESWet Processing Manual Wet Bench Stations for Clean Room ApplicationsCSE’s wet processing manual wet benches are available in a wide variety of configurations. Standard construction will support both acid and solvent applications. Our standard wet benches give you all of the process and safety features as our fully automated or semi-automatedwet bencheswithout the extra cost for robotics. Our electrical and mechanical engineers prepare sign off drawings for each wet bench order. Our 30 plus years of continues business operation gives you the satisfaction you deserve. All process, etching or cleaning components are built and designed in-house giving you complete turnkey support.Benefits of Wet Processing Manual Benches:§ High end manual eq...
Single cavity vertical dryer -CSEApplication of CSE cleaning system to various cleaning and drying processes AdvantageCSE cleaning system is applied to various cleaning and drying processesDifferent configurations (devices that can be placed on desktop operations, single independent, double chambers) for wafer size to 200mm best area, equipment with rollers can be movedSuperior reliabilityUnique modular structure it is extremely easy to repairEasy to use and operate The cleaning and drying machine is equipped with two kinds of automatic and manual systems. It is capable of complicate and different process requirements. Its stability and ease of operation will bring additional economic benefits to any factory. RinseSte can handle wafers of different sizes. The software program th...
CSE Automatic electroless electroless equipmentAdvantageThe wet process system is used for electroless aluminum plating, copper substrate material (Ni, Pd, Au)(metal UBM under convex points)Suitable for size to 300mm waferThe longest service life benefits from the most advanced software and hardware maximum reliability and compatibilityEffective support for using Fraunhofer Technology maximum capacityMore bottomed production costs CSE fully automatic electroless electroless equipment (Hua Xuedu), design and ApplicationA wafer with a maximum high capacity diameter of 300mm, unique software and hardware guaranteeLong life and unrivalled low production costs.The real-time analyzer and the optimized dosage of the process have excellent process control ability. Features and advantages...